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AS1323
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 3. Absolute Maximum Ratings
Parameter
VBATT, SHDNN, LX to VSS
Maximum Current VOUT, LX
Thermal Resistance Θ JA
Electro-Static Discharge
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Package Body Temperature
Min
-0.3
-40
-65
Max
+5
1
207.4
2
+85
+150
+150
+260
Units
V
A
oC/W
kV
oC
oC
oC
oC
Comments
on PCB
HBM
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020 “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Revision 1.07
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